As high-temperature binders used in the molding of ceramics and unshaped refractory castables, methyl cellulose, carboxymethyl cellulose, aluminum phosphate, aluminum dihydrogen phosphate, etc. are generally used, but they are adhesives with only one main material. According to the situation, when forming porous ceramics or special ceramics with complex shapes, it cannot cope with wax balls as forming cores, flowing into ceramic paste to remove dry moisture, wax balls occupy 50% of the cross-sectional area, so the diffusion of moisture during drying. Even if the water is dried in the sun, the wax ball dissolves in the removal process or after removal, the dough strength is low and cannot withstand the vibration of the billet. During the firing process, from 500 to before the porcelain, the green body has almost no strength, even a static box furnace can be fired, but in a dynamic firing furnace (tunnel kiln, etc.), it often collapses due to vibration .
The high temperature adhesive is aimed at the problems existing in the molding process of the above special ceramics and amorphous refractory castables, and a high temperature composite adhesive is developed by adding an appropriate amount of organic binder and inorganic binder to the refractory powder. ; Among them, the refractory powder plays a role in high temperature resistance, the organic binder plays a bonding role at a lower temperature, and the inorganic binder plays a bonding role at a high temperature. The body has a certain strength and can withstand the repair of the abrasive body and the vibration of dynamic firing.
After a lot of comparative analysis, prescription design, and selection of prescription range for the high-temperature adhesive, the prescription range and matching process of the present application are obtained. The high-temperature composite adhesive of the present invention is formed by adding an appropriate organic adhesive and an appropriate inorganic adhesive to the refractory powder for compounding, the refractory powder has the effect of high temperature resistance, and the organic adhesive has a relatively low The bonding effect is exerted at the temperature, and the inorganic adhesive exerts the bonding effect at the high temperature.
